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liquid compound constructed with heavy cutting micro abrasives to remove coarse scratches from both fresh and fully cured gel coats using a heavy cutting pad
while with a polishing pad
non-Petroleum
This Next-Level combination reduces cycle time up to 75% for faster production
It is EXTREMELY CONCENTRATED and HOMOGENEOUS so it will not separate
LP1, Leveling Polish Size:250ml liquid compound constructed with heavyLP1 LEVELING POLISH is a unique compounding polishing that combines five different abrasives 2 cutting abrasives, and 3 finer polishing abrasives. This New LEVEL Technology accelerates the cutting and polishing performance beyond any current compounds or polishes. LP1 can easily remove sand scratches, using a wool or foam cutting pad, and then polish out the cutting marks and holograms using a polishing or finishing foam pad to achieve a glass like
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